Which manufacturing projects were directly funded by the CHIPS and Science Act and where are those facilities located?
Executive summary
The CHIPS and Science Act has translated into direct federal grant awards and preliminary memoranda of terms for dozens of semiconductor manufacturing projects across the United States, with more than $30 billion in proposed private‑sector investments tied to 23 projects and 16 new fabs to date [1]. Major, explicitly named recipients whose projects received CHIPS funding or preliminary terms include Micron (Clay, NY; Boise, ID), Samsung (Taylor and Austin, TX), Intel (multi‑state fabs including Arizona and an Ohio hub), TSMC (Phoenix, AZ), GlobalFoundries (Malta, NY and Essex Junction, VT), Hemlock Semiconductor (Hemlock, MI), and several wafer, packaging and specialty suppliers [2] [1] [3] [4] [5] [6].
1. Major headline grants and where the facilities are located
Micron announced a CHIPS grant of about $6.1 billion for a new semiconductor campus in Clay, New York, and a leading‑edge fab in Boise, Idaho [2], while Samsung received roughly $6.4 billion in grants to expand capacity at a new Texas site in Taylor and at its Austin facility [2]. Intel’s award—reported as up to $8.5 billion in grants coupled with loan authorities—supports two fabs on its Arizona campus and a broader slate of projects that include expansions or new investments in Oregon, New Mexico and a planned semiconductor hub in Ohio [3] [4]. Taiwan Semiconductor Manufacturing Co. (TSMC) is building three factories in Phoenix and received CHIPS funding reported at about $6.6 billion for that effort [4]. GlobalFoundries was awarded funding to expand at Malta, New York and Essex Junction, Vermont [4]. The Commerce Department and related trackers have also identified Hemlock Semiconductor as a prospective CHIPS direct‑funding recipient to build a polysilicon purification/manufacturing facility in Hemlock, Michigan (up to $325 million in PMTs) [7] [5].
2. Smaller but strategic manufacturing and supply‑chain projects and locations
Beyond the headline memory and logic fabs, the CHIPS program has advanced funding for specialized upstream and packaging projects: GlobalWafers was slated to receive direct support for a 300mm SOI wafer plant in St. Peters, Missouri [6]; the Department of Commerce announced awards or PMTs for firms building advanced packaging, test, and materials facilities such as SK hynix’s HBM packaging and R&D facility (award noted on Dec. 19, 2024) and other packaging/test investments identified in PMTs for companies like Infinera and Edwards Vacuum in California, Pennsylvania and New York [6] [7] [5]. Commerce’s tally of CHIPS‑linked private investments spans 23 projects across 15 states as of the department’s August 2024 summary [1].
3. What “direct funding” means in these announcements
Many of the named awards are recorded as direct CHIPS grants or as non‑binding preliminary memoranda of terms (PMTs) that outline proposed direct funding levels and project scopes; Commerce and NIST administer the CHIPS for America award process and release PMTs before final disbursements tied to milestone achievement [5] [1]. The program’s $39–50 billion manufacturing bucket finances a mix of large‑scale fab grants, loan authorities, and targeted grants for materials, tooling and packaging, and some awards are coupled with federal loans or tax credits rather than solely upfront cash [8] [1].
4. Limits, omissions and areas that still require scrutiny
Public reporting and government trackers list dozens of projects but often use provisional language (PMT, “up to” funding) and do not always publish final disbursement details or precise addresses in the same release, so some project locations are tied to company announcements or aggregated trackers rather than a single definitive government dataset [7] [6] [3]. Coverage differs by outlet: the Commerce Department summarizes program scale and counts of projects [1], industry trackers and investigative summaries fill in granular site lists and proposed award amounts [3] [6] [4], and some entries remain described only as “proposed” until final awards and milestone payments are published [5].
5. What to watch next
Expect the Department of Commerce and NIST to convert more PMTs into final awards with milestone schedules and for state‑level announcements to flesh out project footprints and job estimates; meanwhile, the list of CHIPS‑funded manufacturing projects to track includes Micron’s Clay and Boise sites, Samsung’s Taylor/Austin investments, Intel’s Arizona and Ohio plans, TSMC’s Phoenix fabs, GlobalFoundries’ New York and Vermont expansions, Hemlock Semiconductor’s Michigan polysilicon plant, and wafer/packaging investments such as GlobalWafers in St. Peters, MO and SK hynix packaging [2] [1] [3] [4] [5] [6]. Where source material here does not specify final award amounts or full site addresses, further confirmation from Commerce’s CHIPS for America award pages and subsequent company filings will be necessary to lock down final, disbursed funding and operational timelines [5] [1].